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5G 4G NR LTE FDD LTE TDD HSPA+ module SIMCOM SIM8200G
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Key attributes
Industry-specific attributes
Chipset
5G MODULE
Application
many applications
Other attributes
Model Number
SIM8200G
Place of Origin
Guangdong, China
Brand Name
SIMCOM
Dimensions
41.0mm 43.6mm 2.8mm
Operation temperature
-40℃ ~ +85℃
Supply voltage range
3.3V ~ 4.3V
Uplink
450Mbps
Downlink
4 Gbps
Packaging and delivery
Packaging Details
standard packaging
Port
SHENZHEN HONGKONG
Supply Ability
Supply Ability
10000 Piece/Pieces per Week
Lead time
| Quantity (pieces) | 1 - 2000 | > 2000 |
| Lead time (days) | 3 | To be negotiated |
Customization
Customized packaging
Min. order: 1000
For more customization details, message supplier
Certifications
RoHS
IC
CEKnow your supplier
Multispecialty supplier6 yrsLocated in CNStore rating
4.9/5
On-time delivery rate
98.4%
Response time
≤4h
Online revenue
$210,000+
Main markets
North America,Eastern Asia,Western Europe
Staff
21
Services
Minor customization
Design-based customization
Quality control
Raw-material traceability identification
Product descriptions from the supplier
1 - 10 pieces
$339.90
11 - 50 pieces
$328.50
51 - 100 pieces
$319.80
>= 101 pieces
$312.85
Variations
Total options:
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